It is found that groove texture has more beneficial effect on polishing quality than pit texture with the same size. Compared with non-textured surface, textured silicon carbide surface can improve polishing conditions.

In addition, groove texture can effectively inhibit the growth of dislocations and defect atoms during polishing. The smaller the groove spacing, the better the polishing quality and polishing behavior. Simulation results show that surface morphology, polishing force and friction coefficient are improved with the increase in groove depth and pit depth. Two typical textures (grooves and pits) with different sizes were compared. Effects of different texture parameters on polishing force, polishing temperature, potential energy, dislocation, stress and friction coefficient were analyzed.

Based on improvement of ultra-precision machining quality by textured surface, specific nano texture was machined on silicon carbide surface. In view of increasing accuracy requirements and difficult machining characteristics of silicon carbide materials, this paper proposes new machining method with ultra-high precision. Current findings provide insights into the ductile deformation behavior of hard brittle ceramics enhanced by field-assisted deformation process. In particular, the formation mechanisms of highly oriented high density stacking faults emitted from grain boundaries are revealed. Specifically, characterizations of Raman spectroscopy on machined surface and cross-sectional transmission electron microscopy on subsurface, as well as molecular dynamics simulations of the two kinds of cutting processes, are jointly performed to elucidate the mechanisms of phase transformation and microstructure evolution that govern the ductile material removal of polycrystalline 3C-SiC under the vibration assistance. In the present work, we report the formation of highly oriented high density stacking faults accompanied with suppressed amorphization and cracking in polycrystalline 3C-SiC in ultrasonic elliptical vibration-assisted diamond cutting, which contributes to significantly enhanced ductile material removal of the ceramic material compared to ordinary cutting.

Revealing the ductile deformation mechanisms of ultra-hard brittle cubic silicon carbide (3C-SiC), as well as their correlations with microstructure evolution, are crucial for facilitating the ductile machinability of the ceramic material.

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